The show connects the decision makers from the industry and demonstrates the most advanced products, bringing in the most up-to-date market and technology trends.
Date: 28 to 30 May 2024
Booth No: 1537
Location: MITEC Kuala Lumpur, Malaysia
Advanced Semiconductor Packaging & Chiplet Show (ASPS) is a B2B event that showcases the latest semiconductor packaging machines and solutions at a glance.
Date: 28 to 30 August 2024
Location: Suwon, South Korea
